星期四, 5月 6, 2021
Home PV News 3D-Micromac receives order from LWD Solar for a microCELL™ TLS half-cell laser...

3D-Micromac receives order from LWD Solar for a microCELL™ TLS half-cell laser system

3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced the order intake for a microCELL TLS laser system for the plant in Langenwetzendorf, Thuringia. The initiator of the investment is the Heckert Solar GmbH, one of the largest and leading PV module manufacturers in Germany with a production capacity of 400 MW at their site in Chemnitz.

Thermal laser separation (TLS) leads to improved module performance compared to conventional scribe and break technology
3D-Micromac AG, the industry leader in laser micromachining and roll-to-roll laser systems for the photovoltaic, medical device and electronics markets, today announced the order intake for a microCELL TLS laser system for the plant in Langenwetzendorf, Thuringia.
The initiator of the investment is the Heckert Solar GmbH, one of the largest and leading PV module manufacturers in Germany with a production capacity of 400 MW at their site in Chemnitz. LWD Solar puts their trust in German and European production equipment due to its technological leadership. The company will manufacture monocrystalline half-cell modules in the new factory with a planned capacity of an additional 400 MW. Production is scheduled to commence in the first quarter of 2021. LWD Solar is going to use 3D Micromac’s TLS technology for cell cutting. Danny B?nisch, project manager for LWD Solar stated: “With our decision for the TLS technology from 3D-Micromac, we are consciously opting for a European solution that supports our efforts to make the domestic solar industry fit for the future again.”
The microCELL TLS system uses thermal laser separation (TLS) to separate silicon solar cells into half cells. The ablation-free process guarantees excellent edge quality. The separated half cells have an up to 30% higher mechanical strength compared to ablative laser processes and show a lower power loss of the solar module over its entire life cycle. Already with delivery, the laser system will be compatible for wafer sizes beyond M6 and is therefore ideally suited for processing future wafer formats.

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